Memory
128 GB
HBM2e
Bandwidth
3.2 TB/s
TDP
550 W
Process
N7 · SMIC
SMIC
FP16
800 T
FP8
—
Perf / Watt
1.45 T/W
Gecko Score
75
Announced
2024-09-01
Available
2024-12-01
List price
—
Cloud $/h
—
Fabricated at
SMIC
N7 · SMIC · die specs TBD
Memory generation
HBM2e · 128 GB
3.2 TB/s · 8 stacks · supplied by CXMT, Samsung
Performance envelope
FP precision matrix · manufacturer datasheet values
| FP16 dense TFLOPs | 800 |
| BF16 dense TFLOPs | 800 |
| FP8 dense TFLOPs | — |
| FP4 dense TFLOPs | — |
| INT8 TOPs | 1,600 |
| Memory bandwidth (TB/s) | 3.2 |
| TDP (Watts) | 550 |
| FP16 TFLOPs per Watt | 1.45 |
Known buyers
Disclosed in SEC filings, earnings calls, and press releases
Geography
HQ and fab locations · feeds /countries
HQ country
China · GuangdongFab locations
China
Supply signal
Hand-curated · the same feed powering the AI Compute Demand Index
Live supply tightness for Ascend 910C is tracked on the Chip Demand Ladder and rolls up into the AI Compute Demand Index. Updated weekly from hyperscaler order books, earnings calls, and secondary-market signals.
Sources
Every spec on this page is reproducible