HBMDevelopment2026
High Bandwidth Memory 4
Next-generation HBM doubling interface width to 2048-bit. Enables 1.74 TB/s per stack. Targeted at NVIDIA Rubin and AMD next-gen. SK hynix sampling to customers, Samsung and Micron in development. First volume expected late 2026.
Bandwidth
1740 GB/s
Interface
2048-bit
Max height
16-hi
Capacity/stack
36-48 GB
Process
1a nm DRAM
Voltage
1.1V
AI chips using
0
Suppliers
3
AI demand
95%
$/GB
TBD
Suppliers
3 companies producing HBM4
SH
SK hynixSamplingMarket share
55%
First to sample, targeting Rubin
S
SamsungDevelopmentMarket share
25%
Behind on 12-hi stacking yield
M
MicronDevelopmentMarket share
20%
16-hi design in validation
Demand breakdown
Pre-production · all output pre-booked by hyperscalers
AI95%
Networking3%
HPC2%
Primary buyers
NVIDIA
AMD
Google