Memory
32 GB
HBM3
Bandwidth
1.64 TB/s
TDP
350 W
Process
N5
TSMC
FP16
918 T
FP8
1,836 T
Perf / Watt
2.62 T/W
Gecko Score
71
Announced
2024-05-14
Available
2024-10-01
List price
—
Cloud $/h
$2.7/h
Fabricated at
TSMC
N5 · die specs TBD
Memory generation
HBM3 · 32 GB
1.64 TB/s · 2 stacks · supplied by Samsung
Performance envelope
FP precision matrix · manufacturer datasheet values
| FP16 dense TFLOPs | 918 |
| BF16 dense TFLOPs | 918 |
| FP8 dense TFLOPs | 1,836 |
| FP4 dense TFLOPs | — |
| INT8 TOPs | 1,836 |
| Memory bandwidth (TB/s) | 1.64 |
| TDP (Watts) | 350 |
| FP16 TFLOPs per Watt | 2.62 |
Rentable on
1 cloud providers · prices refreshed from public APIs
Known buyers
Disclosed in SEC filings, earnings calls, and press releases
| Company | Disclosed quantity | Year |
|---|---|---|
| internal · Gemini 2 training | 2024 |
Generation lineage
What came before · what comes next
Geography
HQ and fab locations · feeds /countries
HQ country
USA · CaliforniaFab locations
Taiwan
Supply signal
Hand-curated · the same feed powering the AI Compute Demand Index
Live supply tightness for TPU v6e is tracked on the Chip Demand Ladder and rolls up into the AI Compute Demand Index. Updated weekly from hyperscaler order books, earnings calls, and secondary-market signals.
Sources
Every spec on this page is reproducible
More from Google
Other chips from the same maker