TSMC
Taiwan Semiconductor Manufacturing Company · Founded 1987 · 
Hsinchu, Taiwan
The world's largest dedicated semiconductor foundry. Fabricates the vast majority of advanced AI chips including NVIDIA, AMD, Google, AWS, Microsoft, and Apple silicon. TSMC's CoWoS advanced packaging is the primary bottleneck for AI chip supply.
Capacity utilization
From quarterly earnings disclosures
| Quarter | Advanced | Mature | Packaging |
|---|---|---|---|
| 2025-Q1 | 95% | 78% | 100% |
| 2024-Q4 | 93% | 75% | 98% |
| 2024-Q3 | 90% | 72% | 95% |
| 2024-Q2 | 88% | 70% | 92% |
Process nodes
7 nodes · from mature to bleeding-edge
Enhanced 3nm · primary node for Apple A17/M3 and ramping for AI chips
Performance-optimized 3nm · NVIDIA Rubin GPU target node
5nm · Google TPU v5p/v6e, AWS Trainium2, Apple M1/A14
2nm GAA · first gate-all-around node at TSMC · risk production H2 2025
Advanced packaging
Interposer, 3D stacking, and chiplet tech
Chip-on-Wafer-on-Substrate · standard interposer · H100, A100
Large-interposer CoWoS · B200, GB200, MI300X · the AI bottleneck
System-on-Integrated-Chips · 3D stacking · next-gen AI packaging
Key clients
Disclosed reservations and contracts
AI chips fabricated
18 chips tracked on BenchGecko
B200GB200
TPU v7
Trainium2GB300
MI355XTPU v6eB300MI325XMI300X
WSE-3
Gaudi 3H100H200
MTIA v2TPU v5p
Maia 100A100Fab locations
5 facilities globally
Geography
Headquarters and global footprint
Hsinchu, TaiwanTaiwan
China
USA
Japan
GermanySources
Every data point on this page is reproducible
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