Samsung Foundry
Samsung Electronics Foundry Division · Founded 2017 · 
Hwaseong, South Korea
Samsung's contract foundry division, second largest globally. Pioneered GAA (Gate-All-Around) transistors at 3nm before TSMC. Fabricates some Qualcomm, Google, and NVIDIA chips. Yield issues at 3nm have limited AI chip wins versus TSMC.
Capacity utilization
From quarterly earnings disclosures
| Quarter | Advanced | Mature | Packaging |
|---|---|---|---|
| 2025-Q1 | 65% | 55% | 70% |
| 2024-Q4 | 60% | 52% | 65% |
| 2024-Q3 | 55% | 50% | 60% |
| 2024-Q2 | 50% | 48% | 55% |
Process nodes
4 nodes · from mature to bleeding-edge
4nm Low Power Plus · Qualcomm Snapdragon, some Google Tensor
3nm Gate-All-Around · first commercial GAA node · yield challenges
2nm GAA · Samsung's next-gen node · competing with TSMC N2 and Intel 18A
5nm · Google Tensor G2/G3, some Qualcomm
Advanced packaging
Interposer, 3D stacking, and chiplet tech
2.5D interposer with 4 HBM stacks · Samsung's CoWoS competitor
3D stacking · SRAM-on-logic · early AI packaging
Key clients
Disclosed reservations and contracts
| Company | Booked thru |
|---|---|
| 2026 | |
| 2025 | |
| 2026 |
Fab locations
3 facilities globally
Geography
Headquarters and global footprint
Hwaseong, South KoreaSouth Korea
USASources
Every data point on this page is reproducible
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