Memory
128 GB
HBM3
Bandwidth
1.6 TB/s
TDP
90 W
Process
N5
TSMC
FP16
354 T
FP8
708 T
Perf / Watt
3.93 T/W
Gecko Score
52
Announced
2024-04-10
Available
2024-06-01
List price
—
Cloud $/h
—
Fabricated at
TSMC
N5 · die specs TBD · 421 mm²
Memory generation
HBM3 · 128 GB
1.6 TB/s · 4 stacks · supplied by SK hynix
Performance envelope
FP precision matrix · manufacturer datasheet values
| FP16 dense TFLOPs | 354 |
| BF16 dense TFLOPs | 354 |
| FP8 dense TFLOPs | 708 |
| FP4 dense TFLOPs | — |
| INT8 TOPs | 708 |
| Memory bandwidth (TB/s) | 1.6 |
| TDP (Watts) | 90 |
| FP16 TFLOPs per Watt | 3.93 |
Known buyers
Disclosed in SEC filings, earnings calls, and press releases
| Company | Disclosed quantity | Year |
|---|---|---|
| Meta | internal · recommendation inference | 2024 |
Geography
HQ and fab locations · feeds /countries
HQ country
USA · CaliforniaFab locations
Taiwan
Supply signal
Hand-curated · the same feed powering the AI Compute Demand Index
Live supply tightness for MTIA v2 is tracked on the Chip Demand Ladder and rolls up into the AI Compute Demand Index. Updated weekly from hyperscaler order books, earnings calls, and secondary-market signals.
Sources
Every spec on this page is reproducible