Memory
288 GB
HBM3e
Bandwidth
8 TB/s
TDP
1400 W
Process
N3
TSMC
FP16
2,300 T
FP8
4,600 T
Perf / Watt
1.64 T/W
Gecko Score
75
Announced
2024-10-10
Available
2025-06-01
List price
$35,000
Cloud $/h
—
Fabricated at
TSMC
N3 · die specs TBD
Memory generation
HBM3e · 288 GB
8 TB/s · 8 stacks · supplied by Micron, SK hynix, Samsung
Performance envelope
FP precision matrix · manufacturer datasheet values
| FP16 dense TFLOPs | 2,300 |
| BF16 dense TFLOPs | 2,300 |
| FP8 dense TFLOPs | 4,600 |
| FP4 dense TFLOPs | 9,200 |
| INT8 TOPs | 4,600 |
| Memory bandwidth (TB/s) | 8 |
| TDP (Watts) | 1,400 |
| FP16 TFLOPs per Watt | 1.64 |
Known buyers
Disclosed in SEC filings, earnings calls, and press releases
| Company | Disclosed quantity | Year |
|---|---|---|
| Meta | undisclosed order | 2025 |
Generation lineage
What came before · what comes next
Geography
HQ and fab locations · feeds /countries
HQ country
USA · CaliforniaFab locations
Taiwan
Supply signal
Hand-curated · the same feed powering the AI Compute Demand Index
Live supply tightness for MI355X is tracked on the Chip Demand Ladder and rolls up into the AI Compute Demand Index. Updated weekly from hyperscaler order books, earnings calls, and secondary-market signals.
Sources
Every spec on this page is reproducible
More from AMD
Other chips from the same maker