Memory
96 GB
HBM3
Bandwidth
2.9 TB/s
TDP
500 W
Process
N5
TSMC
FP16
667 T
FP8
1,334 T
Perf / Watt
1.33 T/W
Gecko Score
78
Announced
2023-11-28
Available
2024-12-03
List price
—
Cloud $/h
$1.75/h
Fabricated at
TSMC
N5 · die specs TBD
Memory generation
HBM3 · 96 GB
2.9 TB/s · 4 stacks · supplied by SK hynix
Performance envelope
FP precision matrix · manufacturer datasheet values
| FP16 dense TFLOPs | 667 |
| BF16 dense TFLOPs | 667 |
| FP8 dense TFLOPs | 1,334 |
| FP4 dense TFLOPs | — |
| INT8 TOPs | 1,334 |
| Memory bandwidth (TB/s) | 2.9 |
| TDP (Watts) | 500 |
| FP16 TFLOPs per Watt | 1.33 |
Rentable on
1 cloud providers · prices refreshed from public APIs
Known buyers
Disclosed in SEC filings, earnings calls, and press releases
Geography
HQ and fab locations · feeds /countries
HQ country
USA · WashingtonFab locations
Taiwan
Supply signal
Hand-curated · the same feed powering the AI Compute Demand Index
Live supply tightness for Trainium2 is tracked on the Chip Demand Ladder and rolls up into the AI Compute Demand Index. Updated weekly from hyperscaler order books, earnings calls, and secondary-market signals.
Sources
Every spec on this page is reproducible