Memory
HBM, DDR, NAND · the bandwidth behind every model.
Top 12 terms
TSMC's next-gen advanced packaging · enables 12+ HBM stacks and multi-die GPUs · used on B300, MI400.
TSMC's previous-gen advanced packaging · used on H100 / A100 · being phased out for CoWoS-L.
Wafer-to-wafer bonding technique that skips bumps · enables 3D stacking for HBM4 and advanced packaging.
Vertically stacked NAND flash · used for AI training data storage · 300+ layers in 2026 flagship nodes.
Next-gen DRAM standard · 8.8-17.6 Gbps · used in servers + CPUs feeding GPU clusters · JEDEC finalized 2025.
Next-gen graphics DRAM · 32-40 Gbps · powers consumer + pro GPUs like RTX 5090, RTX 6000 Ada next-gen.
? GB/s memory at ? GB per stack · from major vendors.
? GB/s memory at ? GB per stack · from major vendors.
? GB/s memory at ? GB per stack · from major vendors.
? GB/s memory at ? GB per stack · from major vendors.
? GB/s memory at ? GB per stack · from major vendors.
? GB/s memory at ? GB per stack · from major vendors.